Enquire Now

Deep Reactive Ion Etcher

MANUFACTURER SPTS Ltd
MODEL MP0531
ACRONYM DRIE

London Centre for Nanotechnology

TRAINING Training is required to use this item and we can arrange this if needed.
CONTACT 1 Steve Etienne
Enquire about this item
SITE Bloomsbury Campus

Description

Surface Technology Systems ICP DRIE, + loadlock, samples up to 6” diameter

Gases: O2, Ar, SF6, CF4, C4F8 Processes: Deep Silicon Etch (Bosch process) to 500+ µm Shallow Si Etch

Specification

Surface Technology Systems ICP DRIE, + loadlock, samples up to 6” diameter

Gases: O2, Ar, SF6, CF4, C4F8 Processes: Deep Silicon Etch (Bosch process) to 500+ µm Shallow Si Etch

Item ID #2431.

Last Updated: 17th January, 2014

Deep Reactive Ion Etcher

There are no publically available categories listed at present. You may have to sign in to browse this catalogue.