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| TRAINING | Training is required to use this item and we can arrange this if needed. |
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| CONTACT 1 | Steve Etienne |
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| Enquire about this item | |
| SITE | Bloomsbury Campus |
Surface Technology Systems ICP DRIE, + loadlock, samples up to 6 diameter
Gases: O2, Ar, SF6, CF4, C4F8 Processes: Deep Silicon Etch (Bosch process) to 500+ µm Shallow Si Etch
Surface Technology Systems ICP DRIE, + loadlock, samples up to 6 diameter
Gases: O2, Ar, SF6, CF4, C4F8 Processes: Deep Silicon Etch (Bosch process) to 500+ µm Shallow Si Etch
Item ID #.
Last Updated: 17th January, 2014
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