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Deep Reactive Ion Etcher

MANUFACTURER SPTS Ltd
MODEL MP0531
ACRONYM DRIE
TRAINING Training is required to use this item and we can arrange this if needed.
CONTACT 1 Steve Etienne
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SITE Bloomsbury Campus

Description

Surface Technology Systems ICP DRIE, + loadlock, samples up to 6” diameter

Gases: O2, Ar, SF6, CF4, C4F8 Processes: Deep Silicon Etch (Bosch process) to 500+ µm Shallow Si Etch

Specification

Surface Technology Systems ICP DRIE, + loadlock, samples up to 6” diameter

Gases: O2, Ar, SF6, CF4, C4F8 Processes: Deep Silicon Etch (Bosch process) to 500+ µm Shallow Si Etch

Item ID #2431.

Last Updated: 17th January, 2014

Deep Reactive Ion Etcher

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