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|TRAINING||No special training required.|
|CONTACT 1||Steve Etienne|
|Enquire about this item|
Dicing saw capable of sawing flat substrates up to 150mm diameter.
We can saw Glass, Quartz, Silicon and other materials by suitable choice of blades.
Silicon dicing cuts
Typical: width 70 µm, depth 1000 µm
High precison: width 26 µm, depth 325 µm
Item ID #.
Last Updated: 17th January, 2014