Enquire Now

Dicing Saw

MANUFACTURER Disco
MODEL Disco

London Centre for Nanotechnology

TRAINING No special training required.
CONTACT 1 Steve Etienne
Enquire about this item
SITE Bloomsbury Campus

Description

Dicing saw capable of sawing flat substrates up to 150mm diameter.

Specification

We can saw Glass, Quartz, Silicon and other materials by suitable choice of blades.

Silicon dicing cuts

Typical: width 70 µm, depth 1000 µm

High precison: width 26 µm, depth 325 µm

Item ID #2433.

Last Updated: 17th January, 2014

Dicing Saw

There are no publically available categories listed at present. You may have to sign in to browse this catalogue.