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| CONTACT 1 | Steve Etienne |
|---|---|
| Enquire about this item | |
| SITE | Bloomsbury Campus |
Surface Technology Systems ICP RIE, + loadlock, samples up to 6 diameter
Gases: CH4, O2, H2, Ar, BCl3, SF6, He, CH4, N2
Process recipes for etching:
Diamond; Si; TiSi2; Al; GaAs and InP
Surface Technology Systems ICP RIE, + loadlock, samples up to 6 diameter
Gases: CH4, O2, H2, Ar, BCl3, SF6, He, CH4, N2
Process recipes for etching:
Diamond; Si; TiSi2; Al; GaAs and InP
Item ID #.
Last Updated: 17th January, 2014
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