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Wafer Bonder


London Centre for Nanotechnology

CONTACT 1 Steve Etienne
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AML-AWB Aligner-Wafer Bonder Platform Overview: • Unique In-situ alignment system (X,Y,Z & θ) • 1-5 micron accuracy depending on options & wafers • Automatic PC control & data acquisition • Application of High Voltage up to 2.5kV • Temperatures up to 560°C • Forces up to 25,000N • Self-contained dry pumping system for vacuum up to 10-6 mBar range. • Forced nitrogen cooling. • 2” to 8” wafers • Automatic alignment system

Item ID #3145.

Last Updated: 29th November, 2018

Wafer Bonder

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