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Shallow Reactive Ion Etcher

MANUFACTURER SPTS Ltd
MODEL MP0532
CONTACT 1 Steve Etienne
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SITE Bloomsbury Campus

Description

Surface Technology Systems ICP RIE, + loadlock, samples up to 6” diameter

Gases: CH4, O2, H2, Ar, BCl3, SF6, He, CH4, N2

Process recipes for etching:

Diamond; Si; TiSi2; Al; GaAs and InP

Specification

Surface Technology Systems ICP RIE, + loadlock, samples up to 6” diameter

Gases: CH4, O2, H2, Ar, BCl3, SF6, He, CH4, N2

Process recipes for etching:

Diamond; Si; TiSi2; Al; GaAs and InP

Item ID #2429.

Last Updated: 17th January, 2014

Shallow Reactive Ion Etcher

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